Characteristic Analysis and Applications of Electromagnetic Shielding Materials for Wireless Communications Device
Han-Nien Lin1, *, Ya-Ying Chen1, Hung-Yun Tsai1, Min-Shan Lin2
Identifiers and Pagination:Year: 2016
Issue: Suppl-1, M5
First Page: 44
Last Page: 53
Publisher Id: TOMSJ-10-44
Article History:Received Date: 9/4/2015
Revision Received Date: 15/5/2015
Acceptance Date: 8/7/2015
Electronic publication date: 15/07/2016
Collection year: 2016
open-access license: This is an open access article licensed under the terms of the Creative Commons Attribution-Non-Commercial 4.0 International Public License (CC BY-NC 4.0) (https://creativecommons.org/licenses/by-nc/4.0/legalcode), which permits unrestricted, non-commercial use, distribution and reproduction in any medium, provided the work is properly cited.
As the trend of consumer electronics and mobile communications devices is obviously developing toward to miniature and high-speed processing, the problem involving with electromagnetic compatibility (EMC) or radio frequency interference (RFI) is becoming more critical for the system integration of high-speed digital and RF mixed signal platforms. This paper is mainly focusing on the characteristics analysis of various electromagnetic shielding materials by utilizing the various shielding effectiveness (SE) measuring methods developed by TDK and ASTM (ASTM D4935). We also adopt the electromagnetic interference (EMI) testing methods developed by IEC for chip level (IEC 61967-3 and IEC 61967-6) to investigate the characteristics and distribution of EMI noise sources. To effectively shield the electric, magnetic, or electromagnetic field originated from noise source, we thus analyze the shielding capability for various materials with different measuring methods. Finally, we will show the EMI reduction and RF performance improvement with implementation of shielding material on module under investigated. With the systematic measurement and analysis described in this paper, we can further identify the related EMI problem and resolve the severe chip or module level EMC problem more effectively.